Micronet Union pays high attention to scientific research and innovation, and follows the principle of "solving business problems with university wisdom". We have established business ties with six renowned universities in China and ready to apply for key tech research projects. Our intention is to deliver first-rate products and strong technical support to our clients by enhancing R&D capabilities.
Enterprise-Oriented Problem
University-Inspired Solution
We are in the process of applying for research projects in key technology areas with partner universities, co-planning industrialization-oriented projects, establishing university R&D internship bases and joint labs, and launching innovative cooperative projects in Wi-Fi field, aiming at enhancing our capabilities in technologies and reserve of specialized talents.
In cooperation with TMC, Tsinghua University, and China Mobile, we conduct research on ULP post quantum crypto processor chip and its application, with a focus on core chips, software, key equipment and SI designed for system and industry applications, to develop quality domestic key components for replacing input ones.
We join hands with UESTC (University of Electronic Science and Technology of China) to apply for the 2022 Research and Development Program in Key Fields initiated by Science & Technology Department of Sichuan Province, which focus on the RF front-end chips of Wi-Fi 6 and 5G intelligent devices, and we strive to overcome difficulties in three key technologies, including chip R&D, integration and packaging.
Our R&D laboratories consist of a software/hardware laboratory, an antenna performance test darkroom, a product system laboratory and a product reliability test room for wireless & wired performance and reliability test, which provides strong support for the R&D and design of the company.